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Solder Preforms
SOLDER PREFORMS
Gold-based Solder Preforms

Our Tech

Minimum Thickness: 0.01mm, Minimum Finishing Size: 0.02*0.02mm.

(Controlling dimensional tolerance strictly and maintaining consistency of solder volume is the precondition )

PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST

Features & Benefits

·? Excellent corrosion resistance

·? Low vapour pressure

·? Excellent wetting properties

·? High-melting-point, and creepless

·? High tensile strength?

·? Superior thermal and electrical conductivity


Application Industries

Military,Semiconducto,Optical Communication,Laser,Medical Equipment,Electricity.

PRODUCT LIST
Solid Line
°C
Liquidus
Eutectic Alloy
Density
g/cm3
Resistivity
μΩ.m
Thermal Conductivity
W/m.K
Thermal Expansion Coefficient
10-6/℃
Tensile Strength
Mpa
/ / 217 7.78 / / / 50.2
/ / 280 14.52 0.224 57 16 276
278 332 / / / / / /
278 301 / 14.18 / / / /
278 289 / 14.34 / / / /
/ / 361 14.67 14.67 44 13.4 185
/ / 910 / / / / /
955 970 / / / / / /
/ / 1064* 19.3 0.0221 318 14 138
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